负片全板电镀表面铜厚极差和蚀刻量关系研究

Study on the relationship between negative film full board electroplating surface copper thickness range and etching amount

负片表铜极差和铜厚过大,线路补偿不足,极易造成线路蚀刻不净及线幼,严重影响品质。文章通过探讨不同电镀时间、不同板尺寸时的电镀极差及不同铜厚时的蚀刻量的关系,从而找出不同线宽线距板生产和设计控制方法,减少上述品质风险。

Negative film surface copper range and copper thickness is too thick, line compensation is not enough, which is extremely easy to cause the line etching not clean and the line too thin, and seriously affects the quality. This paper discusses the different plating time, different plate size, the relationship between etching amount range and different plating copper thickness, to find out different line width from board design and production control method, to reduce the quality as said or narrated above.