摘要
印制电路板制造流程中的阻焊工艺,针对过孔(via)基本会选择作塞孔处理。作双面阻焊的产品塞孔技术已经非常成熟;而针对薄板不能采用双面阻焊的,会有效率不高或导通孔孔口假性露铜(发红)的现象。本文主要介绍了自主研发的板厚为0.1 mm^0.6 mm的薄板阻焊塞孔技术,能够使薄板保质保量快速完成阻焊工艺,供同行业参考。
Resistance welding process in printed circuit board manufacturing process is studied in view of the through hole(via) basic to be selected to make plug hole processing. Double resistance welding products plug hole technology has been very mature; And double resistance welding will not be used for sheet, efficiency is not high or pseudo dew copper conduction hole orifice(red). Independent research and development is mainly introduced in this paper with the thickness from 0.1 mm to 0.1 mm sheet resistance welding technology, to make the sheet fast complete resistance welding, with good quality for the industry reference.
出处
《印制电路信息》
2013年第S1期168-171,共4页
Printed Circuit Information
关键词
阻焊工艺
过孔
阻焊塞孔
薄板
Resistance Welding Process
Via
Resistance Welding Plug Hole
Sheet
