沉金镍腐蚀机理及金槽影响因素研究

Research on nickel corrosion problem and gold tank parameters

随着无铅化产业的推进,沉金工艺作为无铅适应性的一种表面处理,由于其各种优点的存在,已愈来愈为更多的SMT厂家乃至终端客户所倚重。也正是由于无铅产业的切换,客户端对于可靠性提出了高要求,而镍腐蚀问题与沉金似乎如影随行,在近些年来引起广泛重视。笔者在前文中针对此课题也做一些研究,主要针对镍槽相关控制参数对镍腐蚀的影响做深入探讨。然而镍腐蚀问题不仅受镍槽影响,其与金槽相关控制要素也紧密相关,笔者在本章中依旧结合生产实际出发,根据实验测试,对影响镍腐蚀的关键因素做一些深入而独特的探讨,分析其内在机理,以期能够帮助到生产实际,为业内同行提升沉金工艺品质提供切实有效的参考。

In recently years, lead-free PCB surface treatment processes were more and more popular in electrical industrial. As one of the lead-free PCB surface treatment process, the electroless nickel/immersion gold(ENIG) was valued by more SMT manufacturers and even end customers because of its advantage. It is due to the exchange, the client had put forward higher requirements of the reliability of the products. But the nickel corrosion was a problem that can’t be solved for a long time for ENIG. In the previous the author had done some research for this topic and the effect of control parameters of Nickel slot on discoloration problems was discussed in that paper . However the nickel corrosion problem is not only inlfuenced by the nickel tank, and is also closely related to the associated control elements with gold tank. The factor of effect on nickel erode was still discussed in this paper by means of some experiments connected to manufacture from the angle of the control of the gold ifligree, and it was hope to be the technology support to improve the quality of ENIG and provide effective reference to enhance the quality of ENIG.