不同表面处理润湿机理研究

Research on the wetting mechanism of different finishes

通过对模拟回流焊锡膏扩展实验,还原了PCB润湿焊接的细节。并结合不同表面处理在不同温度条件下的润湿天平测试,对比了不同表面处理在不同温度条件下的润湿平衡曲线走势及其润湿性能变化,从润湿过程角度解析了不同润湿平衡曲线的物理化学意义,深化了对润湿过程的理解,为快速定位可焊性不良问题提供了分析思路及依据。

In this paper, based on the solder paste spreading experiment, wetting details during PCB welding procedure were described. By using the wetting balance methods, the shapes of wetting balance curves and the wettability changes of different ifnishes under different temperatures were contrastively analyzed, the physical and chemical signiifcances of different wetting balance curves were discussed from the perspective of the wetting process, the understanding of the wetting process was deepen and ideas and basis were provided for the quickly problem locating in the poor solderability analysis.