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电镀Au/Ni表面形貌改善的研究 被引量:2

The study on improvement surface topography of electroplating Au/Ni
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摘要 在封装基板生产过程中,电镀镍-金表面形貌对金属线键合的金属丝线拉力有着显著的影响。金面形貌取决于电镀镍面形貌,电镀镍结晶晶粒粗大、均匀,有利于提高金线与金面焊接有效面积,镍面粗糙度增大(Ra=0.33μm±0.02μm),能够有效提高金属线键合可靠性。通过改善基铜形貌、降低电流密度以及减少电镀镍光亮添加剂含量,改善电镀镍的结晶过程,使得晶核生长速度大于核形成速度,进而达到电镀镍结晶晶粒粗大、均匀。改善后金属线键合的金属丝线拉力可稳定在7 gf以上。 During the course of package substrate production, the surface topography of Au/Ni plating has signiifcant inlfuence on the wire bonding wire pull. The Gold surface morphology depends on the crystallization process of Ni plating. Electroplated nickel crystal coarse grain, uniform, is favorable for improving the contact area. The nickel surface roughness increase can effectively improve the reliability of wire bonding. Through the improvement of copper morphology, lower current density and reduced nickel plating brightener content, improvement crystallization process of nickel plating, the crystal nucleus growth velocity is larger than the nucleation, achieve the electroplating nickel crystal coarse grain and uniform. The will pull steadily above 7gf before improved.
出处 《印制电路信息》 2013年第S1期231-237,共7页 Printed Circuit Information
关键词 电镀镍-金 结晶 表面形貌 金属线键合 Electroplating Au/Ni Crystallize Surface Topography Wire Bonding
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  • 1Luo, J.K.,Pritschow, M.,Flewitt, A.J.,Spearing, S.M.,Fleck, N.A.,Milne, W.I.Effects of process conditions on properties of electroplated Ni thin films for microsystem applications[].Journal of the Electrochemical Society.2006

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