摘要
文章结合PCB板件发展趋势以及在检测过程中的实战经验,通过AOI逻辑研究和应用,对PCB检测影响因素进行了系统全面的分析,从影像摄取、逻辑算法等多纬度进行分析和试验验证,总结出一套适合厚铜、特殊材料等板件的AOI检测解决方案。
Refer to the development of PCB and experience on inspection. And according to the inspection and experiment's data,we got a systemic analysis on inspection of PCB. This thesis describes the inspection method on many points of view such as equipment's imaging grasp and AOI arithmetic. Finally we summarize a series of feasible solutions on inspection of PCB of thick copper, Special Material etc.
出处
《印制电路信息》
2013年第S1期252-259,共8页
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