高层厚铜板耐热可靠性研究

The reliability study of thermostability for high layer heavy copper PCB

厚铜板做为具备高散热及高电流承载能力的特种板,已经广泛运用于大电源和高功率等类型的电子产品上。目前大多数的线路板厂也已经具备了此类板的生产制作能力,但是对于高多层厚铜板产品,在做比较严苛的耐热可靠性测试时往往会出现裂纹及爆板等异常。文章主要从实际产品热冲击出现PP层裂纹异常入手,针对工程资料设计不同的结构,并进行试验验证查找问题产生的原因,为高层厚铜板可靠性提升提出工程设计建议。

The heavy copper boards that have high heat and high current carrying capacity have been widely used in the large current and high power, and other types of electronic products. At present most of the PCB factories have ability to manufacture this kind of board.But for multilayer heavy copper products, in stricter heat resistant reliability test, we often find crack and delamination.In this article we started from the crack that our products appear in the thermal shock, to design different structure, and through the test to find out the reason of the problem.Through the test we will give advise to engineer for better heat-resist in heavy copper PCB manufacture.