摘要
高密度互连电路板不断趋于薄型化。文章介绍了高密度互连电路板所用介质材料薄层化发展状态,并对薄型化加工中的关键技术问题进行了探讨。
The high density interconnecting printed circuit board is becoming thinner and thinner. In this paper the thinning technology development status of dielectric material used in high density interconnecting printed circuit board was introduced, and the key technical issues in the thinning processing were discussed.
出处
《印制电路信息》
2013年第S1期300-303,共4页
Printed Circuit Information
关键词
高密度互连
介质材料
薄型化技术
玻璃纤维布
阻抗
翘曲
High Density Interconnecting
Dielectric Material
Thinning Technology
Glass Fiber Cloth
Impedance
Warping
