HDI板塞埋孔微裂纹研究和改善

Research and improvement of the micro-crack of HDI PCB plug buried hole

文章在分析塞埋孔微裂纹机理的基础上系统研究了烘板工艺,半固化片树脂含量和不同塞埋孔树脂及塞埋孔前处理工艺等对塞埋孔微裂纹的影响,通过增加黑化前烘板流程、优先选择高树脂含量的半固化片、塞埋孔前采用棕化前处理并优先选择与半固化片Tg和Z-CTE一致性更好的树脂塞埋孔,实现了塞埋孔微裂纹的显著改善,并有效控制了HDI分层风险。

This paper discusses the theory of micro crack around buried holes. Some experiments are designed and executed on such base. According to the experiment results, the process is optimized by inserting bake process between AOI and black oxidation and implement brown process as plugging pre-treatment, and prepreg with high resin content is preferentially recommended;the Tg and Z-CTE of prepreg and ink should be as consistent as possible. If all these measures is taken, the micro crack around buried holes will be under control and the reliability of HDI products will be improved remarkably.