刚挠结合板层压分层研究

The study of delamination for rigid-flex PCB

随着刚挠结合板的应用范围越来越广泛,对刚挠结合产品可靠性的要求也越来越高,而刚挠结合板制作的重点主要是保证刚性板部分与挠性板部分通过层压使之结合在一起后的可靠性,如何保证其可靠性,使之不会出现分层问题,是加工刚挠结合板的最大难点。文章分析了影响刚挠结合板层压分层的关键结构因素和工艺方法,并通过因素分析、试验验证,制定出层压加工方案,提升了刚挠结合产品的层压可靠性。

With the increasingly wide application of the rigid-flex boards, the requirement for this kind of products' reliability is getting higher. However, the key to making rigid-flex boards is to ensure reliability caused by lamination of rigid boards and flex boards. The most difficult task is how to ensure its reliability. The thesis studies the main factors and methods that affect the reliability, and advance the optimized methods and parameters.