双面蚀刻型埋容材料PCB制作工艺

The manufacturing process of PCB with double-side etching embedded capacitor material

早期的埋容材料受限于材料自身的结构强度,只能采用单面蚀刻的工艺,导致PCB加工工艺流程过长,不仅成本高昂,且材料涨缩变形不易控制,该文以某公司的某双面蚀刻埋容材料为研究对象,介绍了双面蚀刻型埋容材料比早期的材料在加工工艺性方面的改良和提高,配合PCB工艺和设计上的优化,为PCB厂商降低了制造成本,同时提高了可靠性,从早期的有铅标准提升到无铅标准。

The structural strength of early embedding materials is limited by the material itself, and only the process side etching can be used. As a result, higher cost & uneasy control material expansion deformation were occurred by the longer manufacturing process. Based on the new embedding materials as research object, the improvement of the double-sided etching embedded capacitor material in manufacturing process was introduced.The technology can optimize process and design, reduce the manufacturing cost. It also can improve the product reliability from lead standard to lead-free standards.