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电子电器废弃物化学提铜金工艺设计

Process Design for Copper and Gold Recovery from Electronic and Electrical Waste by Chemical Process
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摘要 以电子电器废弃物作为原料,分别采用硫酸搅拌浸出-电解工艺以及硝酸处理铜浸渣结合氰化板卡脱镀-锌置换-王水提纯工艺,经浸出、置换、电积、析出等工序回收铜和金。 Copper and gold were recovered from electronic and electrical waste.The adopted processes are sulfuric acid stirring leaching-electrolysis and nitric acid treatment of copper leaching residue combined with cyanide plating off the board-zinc replacement-purification with aqua regia,respectively,including the process steps of leaching,replacement,electrodeposition and precipitation.
出处 《稀有金属与硬质合金》 CAS CSCD 北大核心 2015年第3期21-24,49,共5页 Rare Metals and Cemented Carbides
关键词 电子电器废弃物 化学提铜金 浸出 置换 工艺设计 electronic and electrical waste copper and gold recovery by chemical process leaching replacement process design
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  • 1开采废弃电子产品[J].产业与环境,1995,17(3):7-11. 被引量:1
  • 2WINKA Michael, CAPPENTER Joeeph. New Jersey Department of Environmental Protection/Union County Demanufacturing Program[J]. IEEE, 1998. 328-330.
  • 3Recycling Electronics[J]. Environment, 2000,42(8) : 6 - 7.
  • 4ZHANG Shunli, FORSSBERG Eric, MENAD No urredine, et al.Metals Recycling from Electronic Scrap by Air Table Separation -Theory and Application[A]. The TMS Annual Meeting[ C]. EPD Congress 1998, San Antonio, USA: 1998. 16- 19.
  • 5ZHANG Shunli. Mechanical Recycling of Electronics Scrap [ J ].Waste Management and Research, 1998(16) : 119 - 128.
  • 6ZHANG Shunli , Forssberg Eric , Arvidson Bo , et al. Aluminum Recovery from Electronic Scrap by High - Force Eddy Current Separation[Jl. Resources, Conservation and Recycling, 1998(23) : 225 - 241.
  • 7KROWINKEL J M, DALMIJN W L. Processing of Televisions by Mechanical Separation Techniques [ D]. 4th International Symposium on Recycling of Metals and Engineered Materials, 2000. 47 - 59.
  • 8FROHLICH G, KRAMER U. Configuration of a Dismantling and Processing Plant for the Recycling of Electrical Equipment and Electronic Scrap[J]. Proceeding of the XX IMPC, Sep 21 - 26, 1997.253 - 260.
  • 9STENNETT A D, WHALLEY D C. Novel Rework Techniques for Electronic Assemblies[J]. IEEE , 1998. 196 - 201.
  • 10HARALD Zebedin, KONRAD Daichendt, PETER Kopacek. A New Strategy for a Flexible Semi-automatic Disassembling Cell of Printed Circuit Boards[J]. IEEE, 2001. 1 742 - 1 746.

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