超声波辅助钎焊铜/铝异种金属接头界面组织性能及强化机制

Interface microstructure and strengthening mechanism of Cu/Al dissimilar metal joint by ultrasonic-assisted soldering

为了研究铜/铝异种金属钎焊接头界面金属间化合物层组织结构对接头性能的影响,从化合物结构出发,提出了一种预涂敷钎料的超声波辅助钎焊复合工艺.结果表明,采用Sn-9Zn共晶钎料,得到细小金属间化合物弥散地分布在铜表面的界面结构,增强了界面强度,其接头抗拉强度甚至超过传统工艺下将金属间化合物层减薄到极限厚度(1~2μm)时的强度.提出了一种基于超声预涂敷工艺的界面化合物结构调控方法,研究了化合物在钎焊过程中的演变规律,以及金属间化合物层在不同结构和分布情况下对接头力学性能的影响,探索了铜/铝异种金属低温焊接的新途径.

A new way of ultrasonic-assisted soldering with ultrasonic precoating process based on the microstructure of the intermetallic compounds was proposed,in order to study effect of the microstructure of interface intermetallic compound layer of copper/aluminum dissimilar metal soldering joint used Sn-9Zn system eutectic filler metal on the mechanical properties of the joint.Intermetallic compound layers formed between copper and solders were crushed into fine particles and scattered in solder with this new way.Tensile strength of the joints was improved extraordinarily,and even more than the tensile strength by traditional process when the intermetallic compound layer thinned to minimum thickness(1-2 μm).A new method of the microstructure of the intermetallic compounds control based on ultrasonic-assisted soldering with ultrasonic precoaling process was proposed.The evolution rule of compounds in the soldering process was studied,and the influence of the structure and distribution of the intermetallic compound layer on the mechanical properties of the joints were discussed.