提高锡锌合金镀层可焊性的探讨

The Way to lmprove Solderability of Sn-Zn Alloy Deposit

本文介绍了无氰柠檬酸盐电镀锡锌合金工艺,用以取代部份镀镉工艺.试验证明,在镀液中加入少量F^-, PO-2^(3-), Pb^(2+), Ce^(2+)离子会有利于提高镀层的可焊性.

Electrodeposition of Sn-Zn alloy from non-cyanide citrate based solution is suggested as a substitute for cadmium plating in some cases. It has been found that small amount of several ions such as F^-, PO_2^(3-), Pb^(2+), Ce^(2+) in the bath may help to improve the solderability of the deposit.