正交试验法在电镀工程中的应用

Application of Orthogonal Array in Electroplating Engineering

运用正交表安排了试验方案,就长管内孔尺寸超差和双层镍铁/铬体系中之低镍高铁中间镀层不亮问题进行了试验,并找出主要因素,选出最佳工艺与操作条件.

Orthogonal Array is applied in planning experiments to optimize the processes for plating chromium film with its thickness close to tolerance onto the inner surfaces of long tubes and for eliminating Fe-Ni alloy deposit from dullness.