摘要
研究了从三价铬溶液中电镀硬铬的工艺和镀层生长机理。结果表明,从具有较低pH值和适当组成的三价铬镀液中可以获得厚度超过50μm的硬铬镀层。镀层呈半光亮状态,由粗大柱状结晶构成,主要以瞬时形核方式生长。
Process and mechanism of hard chromium plating from a trivalent chromium bath were investigated.The results showed that hard chromium film thicker than 50 μm can be electrodeposited from a properly formulated trivalent chromium bath at lower pH.The obtainable semi-bright film is composed of columnar crystals and grows up in the manner of transient nucleating.
出处
《电镀与涂饰》
CAS
CSCD
1993年第4期5-8,共4页
Electroplating & Finishing