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Research and Application of MEMS Technique at BSRF

Research and Application of MEMS Technique at BSRF
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摘要 LIGA technique has been developed since 1993 at BSRF, including the fabrication of LIGA mask, deep X ray lithography, electroplating, the pouring molding and the applications in some fields. The LIGA mask with gold absorbing structures of 20μm thickness and 5μm width and Kapton membrane of around 5μm thickness has been successfully fabricated and applied to the deep X ray lithography with the PMMA structure of 1mm thickness or above. The beamline from a wiggler is used for the deep X ray lithography of LIGA station and is open to other institutes researching the deep X ray lithography. The normal process of LIGA technique with the exception of molding has been established with the PMMA structures of 500μm thickness at BSRF. The largest aspect ratio of PMMA structures can reach about 50 with the height of 500μm and the lateral size of 10μm. The nickel and copper structures with the thickness of 0.5mm and 1mm have been made by using the electroplating technique. The SU8 as a resist material of deep etch lithography with UV light is also developed in the fabrication of LIGA mask and some devices at BSRF.Electromagnetic stepping micro motor, heat exchange, accelerator, structures used in the EDM (electro discharge machining) are being developed for the future applications. LIGA technique has been developed since 1993 at BSRF, including the fabrication of LIGA mask, deep X ray lithography, electroplating, the pouring molding and the applications in some fields. The LIGA mask with gold absorbing structures of 20μm thickness and 5μm width and Kapton membrane of around 5μm thickness has been successfully fabricated and applied to the deep X ray lithography with the PMMA structure of 1mm thickness or above. The beamline from a wiggler is used for the deep X ray lithography of LIGA station and is open to other institutes researching the deep X ray lithography. The normal process of LIGA technique with the exception of molding has been established with the PMMA structures of 500μm thickness at BSRF. The largest aspect ratio of PMMA structures can reach about 50 with the height of 500μm and the lateral size of 10μm. The nickel and copper structures with the thickness of 0.5mm and 1mm have been made by using the electroplating technique. The SU8 as a resist material of deep etch lithography with UV light is also developed in the fabrication of LIGA mask and some devices at BSRF.Electromagnetic stepping micro motor, heat exchange, accelerator, structures used in the EDM (electro discharge machining) are being developed for the future applications.
出处 《光学精密工程》 EI CAS CSCD 2001年第5期430-434,共5页 Optics and Precision Engineering
关键词 LIGA MEMS MICROFABRICATION microsystems LIGA MEMS microfabrication microsystems
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参考文献5

  • 1Mohr J, Ehrfeld W,Munchmeyer D. Requirements on resistlayers in deep-etch synchrotron radiation lithography[J]. J. Vac. Technol. 1988,B6(6).
  • 2Becker E W, Ehrfled W, et al. Fabrication of microstructures with high aspectratios and great structural heights by synchrotron radiation lithography, galvanoforming,and plastic moulding (LIGA process)[J]. Microelectronic Engineering 1986,(4):35-36.
  • 3Tang Esheng,Yan Yonglian, Xia Shaojian, et al. New wiggler beamline at BSRF[J]. J.Synchrotron Rad. 1998,(5):530-532.
  • 4Pantengurg F J, Chlebek J, El-Kholi A, et al. Adhesion problems in deep-etch X-raylithography caused by fluorescence radiation from the plating base[J]. MicroelectronicEngineering, 1994,23:223-226.
  • 5Lehr H, Ehrfeld W. LIGA-technique, An overview[A]. The 6th Chinese internationalsummer school of physics application of synchrotron radiation, Lecture Notes[C]. Beijing,China,1992.15-20.

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