摘要
以络合物和电化学的基本理论为依据,利用络合物生成(平衡)常数 K、稳定常数 K_稳和难溶电解质的溶度积常数 K_(sp)间的关系,推导了电镀溶液中金属离子和络合剂浓度间关系的计算公式;阐述了络离子的形成对阴极电极反应、标准电极电位、过电位和电镀时金属析出电位的重要影响,从而为合金电镀提供了重要的理论依据。
On basis of basic theories of complexing compound and electrochemistry, relationship between equilibrium constant (K),stability constant (K_s) of complexing compound and solubility product constant (K_(sp)) of slightly soluble electrolyte is applied to derive equations between theoretic concentrations of metal ions and complexing agent in electroplating solutions.Effects of formation of complexing ions in electroplating on cathodic electrode reaction,standard electrode potential,overpotential and metal deposition potential are also discussed,therefore providing im- portant theoretic basis for alloy electroplating.
出处
《电镀与环保》
CAS
CSCD
1993年第6期3-6,共4页
Electroplating & Pollution Control
关键词
过电位
络合剂
电镀
工艺
电化学
Polarization
Overpotential
Complexing agent
