摘要
探讨了积层印制板的制作时,内层铜箔的氧化处理对剥离强度影响,以及通过铜箔外观颜色来判断氧化处理条件。
The paper studied the influence of the oxidized internal layer copper foil to the bond strength while buildup PCB was produced. It also pointed out how to decide the oxidation condition according to the color of the copper foil.
出处
《印制电路信息》
2004年第6期34-35,62,共3页
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