摘要
双面铝基板的层压加工有别于目前普通的FR4多层板的层压生产,属于一种特殊工艺,主要原因就是它的层压结构有所不同。此文主要介绍了双面铝基板的层压加工的控制要点。
The pressing process of the double-sided Al substrate is different from the normal FR4 multilayer board production. It is a special technology, the key different lies in its stack-up structure, this article mainly introduces the control factors of pressing process for double-sided Al Substrate.
出处
《印制电路信息》
2004年第6期43-44,共2页
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