摘要
随着电子工业飞速发展以及人们环保意识的提高,以"绿色焊接"为主题的电子装配技术对无铅焊料的需求也尤为迫切。本文从焊料可焊性和焊接结构的可靠性等方面介绍了近年来国内外无铅焊料研究方面的最新成果;着重概括了为提高焊接性能而在配料组分、金属间化合物析出与组织控制等工作,重点阐明了稀土元素在焊料组织控制中的关键作用;针对我国稀土资源蕴藏丰富的特点,指出了无铅焊料进一步发展的方向。
With the rapid development of electronic assembly industry and improvement of people′s knowledge of environmental nature, lead-free solder, called as 'green solder', was urgently expected in the electronic packaging technology. Here recent achievements on the lead-free solder were presented in view of joint manufacturing and structural reliability. Research work on alloying, especially the addition of rare earth, and intermetallics formation in the solder was summarized with an effort to improve the joint performance. Further development of lead-free solder was proposed according to the abundant resource of rare earth in China.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2004年第4期403-406,共4页
Journal of Functional Materials
基金
天津市自然科学基金资助项目(033608811)
关键词
无铅焊料
金属间化合物
共晶合金
稀土
lead-free solder
intermetallics
eutectic alloys
rare elements
