摘要
电子封装无Pb化进程中,对无Pb钎料可焊性镀层技术的发展和应用提出了要求.本文给出一种碱性焦磷酸盐镀液及其电沉积工艺,以获得Sn-Ag无Pb焊料的可焊性镀层.研究了镀液中的主盐浓度、电流密度、镀液温度及搅拌等工艺条件对镀层中Ag含量及镀层表面形貌的影响.
In the road-line map of the lead-free soldering for electronic packaging, the development and application of the lead-free solder coating on Cu matrix is a key step. In this paper, an alkaline pyrophosphate bath and the electroplating processing is developed for a Sn-Ag lead-free solder coating. The research results are focused at effects of the bath composition and the processing parameters on silver content and morphology of the coating, the processing parameters include cathodic current density, bath temperature and agitation.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
2004年第8期822-826,共5页
Acta Metallurgica Sinica
基金
国家自然科学基金项目 50228101
国家863计划项目2002AA322040资助
关键词
无Pb焊料
电镀
Sn-Ag合金
电子封装
lead-free solder
electroplating
Sn-Ag alloy
microelectronic packaging
