期刊文献+

玻璃微流控芯片的制作 被引量:16

Fabrication of Glass Microfluidic Chip
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摘要 玻璃微流控芯片的研究在近十年得到了重视 ,但是多数研究基于 7740玻璃制作 ,由于基材需要抛光以及涂覆掩蔽层 ,价格昂贵 .作者研究了一种在商品化的SODA LIME玻璃 (掩蔽层为厚度 14 5± 15nm的Cr和 5 75±2 5nm的光刻胶S10 8)上制作微流控芯片的方法 ,减少了对掩蔽层溅射设备的需求 ,降低了生产成本并缩短了生产周期 .采用照相制版的方法制作沟道宽度为 5 0 μm的掩模 ;光刻后根据沟道深度要求选择腐蚀液湿法腐蚀沟道 ;优化超声钻孔仪的电流参数制作直径 3mm的储液池 ,清洗后采用热键合对芯片进行封接 ;最后在有效分离长度为3 5mm的芯片上实现多组分样品分离 。 Many researches have focused on the glass microfluidic chip in the past decade and most of them are based on Pyrex 7740. Since the substrate needs polishing and sputtering masking layer, the chip is expensive. This paper presents a new way to fabricate microfluidic chip which is made from commercialized SODA LIME glass (the masking layer is Cr with thickness of 145±15 nm and the photoresist is S108 with thickness of 575±25 nm). The sputtering before photolithograph is avoided thus it cuts down the cost and shortens the production cycle. The mask was photoengraved to obtain a 50 μm wide pattern; following the photolithograph, a reagent was chosen to wet etch the glass substrate; 3 mm diameter reservoirs were formed using an ultrasonic driller with its current parameters optimized; after cleaning the substrate, the glass chip packaging was finished by direct bonding. The multi ingredient sample separation was realized on the 35 mm long chip, and LIF was used to detect the signal.
出处 《纳米技术与精密工程》 CAS CSCD 2004年第1期20-23,共4页 Nanotechnology and Precision Engineering
基金 国家 8 63高技术研究发展计划MEMS重大专项B类资助项目(2 0 0 2AA40 4 4 60 )
关键词 玻璃 微流控芯片 制作 湿法腐蚀 热键合 microfluidic chip wet etching direct bonding
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参考文献6

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二级参考文献8

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