印制电路技术发展方向的探索

The probing of Development Tendency of Printed Circuit Techique

从七个方面论述印制电路技术近期发展趋势,并探索其今后的发展方向。作者的结论是:加成法、半加成法与通用的减成法同时并存;图形蚀刻法不再是制造印制板的唯一方法;过去为人们所称道的酸性胶体钯已经暴露出许多不可克服的缺陷;镀前处理出现新的高锰酸盐凹蚀/去腻污工艺;曾经是先进技术的光亮铅锡电镀逐渐为不光亮铅锡电镀加热风整平技术所更新;直流的、慢沉积、高氰化合物插头镀金已被脉冲、高速、低氰或无氰插头镀金所汰淘;一种新型的过氧化氢/硫酸蚀刻技术显示了强大的生命力,与常用蚀刻技术完全不同的有机蚀刻铜试剂已经问世。

The paper deals with the development tendency of printed circuit Technique in seven aspects. It was noted that additive, semi-additive and subtractive processes could exist simultaneouly; the figure etching process may not be the only process for making PCB any more. The plating process for PCB could be even largely improved.