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改性咪唑类潜伏性环氧树脂固化剂的制备 被引量:3

Preparation of Modified Imidazole Latent Curing Agent for Epoxy Resin
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摘要 由丙烯酸、甲基丙烯酸甲酯、丙烯酸丁酯等的共聚反应制备了有一定亲水性的丙烯酸树脂 ,然后利用制备的丙烯酸树脂对咪唑和 2 -乙基 - 4 -甲基咪唑进行改性制备具有一定潜伏性的环氧树脂固化剂 ,该固化剂可以和环氧乳液进行复配 ,具有较好的相容性 ,可制备出单组分丙烯酸树脂环氧树脂铝箔涂覆材料 ,该材料涂覆于铝箔表面 。 A slightly hydrophilic acrylic copolymer resin has been prepared based on acrylic,methacrylic and butyl acrylate,which is then used to modified the Imidazole and 2-ethyl-4-methyl Imidazole to prepare the title latent curing agent for epoxy resin.This latent curing agent shows good compatibility with epoxy emulsion for preparation of one-component acrylic epoxy resin coatings for aluminum foils with good corrosion protection and smooth film.
出处 《涂料工业》 CAS CSCD 2004年第7期23-25,共3页 Paint & Coatings Industry
关键词 环氧树脂 丙烯酸树脂 潜伏性固化剂 耐腐蚀性 2-乙基4-甲基咪唑 ethyl-4-methyl Imidazole,epoxy resin,acrylic resin,latent curing agent,corrosion protection
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  • 1陈连喜,张惠玲,雷家珩.环氧树脂潜伏性固化剂研究进展[J].化工新型材料,2004,32(7):29-32. 被引量:30
  • 2陈连喜,张惠玲,刘全文,雷家珩.间甲苯胺改性双氰胺衍生物的合成[J].武汉理工大学学报,2005,27(8):11-13. 被引量:18
  • 3陈连喜,张惠玲,刘全文,王钧.芳香胺改性双氰胺/环氧树脂体系的固化特性[J].武汉大学学报(理学版),2006,52(4):426-430. 被引量:5
  • 4史俊,崔进,李恒娟.一种新型改性双氰胺固化剂的合成及性能研究[J].中国胶粘剂,2006,15(10):15-17. 被引量:8
  • 5刘守贵,甘国华,王家贵.环氧树脂胺系固化剂改性综述[J].热固性树脂,1996,11(4):46-51. 被引量:34
  • 6BUDRUGEAC P, SEGAL E. Application of isoeonversion- al and multivariate non-linear regression methods for evaluation of the degradation mechanism and kinetic pa- rameters of an epoxy resin[ J]. Polym. Degrad. & Stabi. , 2008,93(6) :I 073-1 080.
  • 7TOLDY A,SZOLNOKI B,MAROSI G Y. Flame retardan- cy of fibre-reinforced epoxy resin composites for aero- space applications [ J ]. Polym. Degrad. & Stab. ,2011,96 (3) :371-376.
  • 8PROKOPEC R, HUMER K, MAIX R K, et al. Influence of various catalysts on the radiation resistance and the mechanical properties of cyanate ester/epoxy insulation systems [ J ]. Fus. Engineer. & Des. , 2009,84 ( 7-11 ) : 1 544-1 547.
  • 9YIN Tao, RONG Min-zhi, ZHANG Ming-qiu, et al. Self- healing epoxy composites-preparation and effect of the healant consisting of microencapsulated epoxy and latent curing agent [ J ]. Comp. Sci. & Tech. , 2007,67 ( 2 ) : 201 - 212.
  • 10PIKE R M,LISANKE R J. Organosilicon methylideneami- no compounds and process for producing the same: US, 2 942 019[ P]. 1960-06-21.

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