摘要
论述了铜铬触头的金相组织与形成机理、金相组织对电气性能的影响及影响结晶组织的工艺因素,阐明了电弧熔炼法铜铬触头材料具有铬在铜基体中呈均匀细小弥散分布的铜铬组织;在开断能力、抗熔焊性、介质恢复强度等电气性能方面均明显优于传统粉末冶金法铜铬触头材料。
This paper describes the microstructure of copper-chromium contact and forming mechanism, the process factors affecting the crystallized structure as well as the influence of microstructure on electric properties. The copper-chromium contact melted with vacuum arc has the microstructure of homogeneous and fine chromium particles distributed dispersively in copper basis. The contact has many advantages in breaking capacity, anti-welding behaviour and dielectric recovery strength, compared with traditional powder metallurgy copper-chromium contact.
出处
《高压电器》
CAS
CSCD
北大核心
2004年第3期191-194,共4页
High Voltage Apparatus
关键词
真空电弧熔炼
铜铬触头
金相组织
vacuum arc melting
copper-chromium contact
microstructure