摘要
半导体制造是一个流程高度复杂,资金高度密集的加工过程,相对于其它制造业来说,其产品种类繁多,工序复杂,对设备的利用率要求较高,因而生产优化也较为复杂。本文利用线性规划(linearprogramming, LP),对半导体制造的封装和测试过程进行数学建模,并构建一套决策支持系统。与电子表格手工计算相比,该系统大大缩短了生产计划响应时间,并提高了瓶颈设备利用率。
The process of semiconductor manufacturing is highly complex and capital intensive.The complexity in semiconductor industry is mainly due to multiple product mix, complicated manu-facturing process, and requirement for high machine utilization. In this paper, we discuss how to uselinear programming to model the semiconductor assembly and test process. We demonstrate that,comparing with traditional manual work using spreadsheets, the LP-based system can significantlyreduce planning responsiveness time while improve the machine utilization of bottlenecks.
出处
《半导体技术》
CAS
CSCD
北大核心
2004年第7期35-39,共5页
Semiconductor Technology
