Cu和Al超高速精密磨削成屑机理研究

STUDY ON CHIP FORMATION MECHANISM OF ULTRA-HIGH SPEED PRECISION GRINDING CU AND AL

建立了超高速精密磨削分子动力学仿真的物理模型 ,合理选择了超高速精密磨削单晶铜和单晶铝的分子动力学仿真势函数。研究了超高速精密磨削分子动力学仿真的基本算法和步骤。对超高速精密磨削单晶铜和单晶铝的分子动力学仿真的结果进行了分析和研究 ,得出了超高速精密磨削单晶铜和单晶铝时工件所能获得的极限表面粗糙度。预测了超高速精密磨削单晶铜时工件表面变形层的极限深度和所能达到的极限加工精度。实验结果表明 ,最小磨削厚度是与磨削刃半径成比例的。

Physics models of molecular dynamics simulation of ultra-high speed precision grinding process are established. Potential function of molecular dynamics simulation of ultra-high speed precision grinding of monocrystalline copper and monocrystalline aluminum is selected properly. Basal arithmetic and step of molecular dynamics simulation of ultra-high speed precision grinding are researched. Results of molecular dynamics simulation of ultra-high speed precision grinding of monocrystalline copper and monocrystalline aluminum are analyzed and researched. Ultimate surface roughness obtained by molecular dynamics simulation of ultra-high speed precision grinding of monocrystalline copper and monocrystalline aluminum is confirmed. The ultimate depth of deformed layer and the ultimate machining precision are forecasted for ultra-high speed precision grinding of monocrystalline copper and monocrystalline aluminum. Results of experiment show that the minimum thickness of cut is in proportion to the cutting edge radius.