金表面聚合物刷及图案化微结构的制备

Preparation of Polymer Brush and Patterned Microstructures on Gold

采用表面引发室温原子转移自由基聚合 (ATRP)方法在金基底上原位制备了接枝聚合物刷 ,其制备过程用厚度测量 ,ATR FTIR ,XPS等进行了表征 ,初始时聚合物刷的厚度随着聚合时间的增加线性增加 ,表现为活性聚合的特征 .XPS表征证明表面引发聚合后聚合物刷末端仍然存在ATRP反应的引发剂 .紫外光刻图案化的聚合物刷作为电沉积的模板 ,经电沉积、后紫外处理、湿化学刻蚀步骤后得到了分离的导电聚合物微阵列结构 ,通过浇注 /粘附处理将导电聚合物微阵列转移至硅油弹性体片 ,由于导电聚合物在湿化学刻蚀中对基底金具有良好的保护作用 ,因此在导电聚合物阵列被转移后 ,基底表面得到金微阵列 .

Polymethyhmethacrylate brush on gold was prepared by surface initiated room temperature atomic transfer radical polymerization. The film thickness grew linearly with the polymerization duration. The reaction procedures were characterized by ATR-FTIR and XPS. XPS characterization verified the presence of initiation moiety at the end of polymer brush. Polymer brush could completely inhibit the redox reaction of K3Fe(CN)(6) probe and so showed efficient electron blocking role. Photo-patterned PMMA brush was used as the template for generating polypyrrole (PPy) microstructures. After post UV treatment and wet chemical etching to remove the gap polymer brush and gold, freestanding PPy micro-arrays were obtained. The as-deposited PPy could prevent the underlying gold from dissolving in KI/I-2 etchant solution. Removal of PPy arrays by a molding/adhesion process left gold pattern on substrate.