钨铜材料和紫铜及铬青铜的热等静压扩散连接

DIFFUSION BONDING OF W-Cu TO Cu AND CuCr_(0.7) BY HIP PROCESSING

用热等静压工艺实现了含铜10％～40％的钨钢材料和紫铜及铬青铜的扩散连接。试样的拉伸强度接近或等于铜端的强度。对结合界面和拉伸断口进行了观察,对铜端的物理、力学性能进行了分析,对与连接质量有关的问题进行了讨论。试验结果表明,铬的存在对扩散连接有利,并改善连接件的综合性能。

Diffusion bonding of W—Cu composites containing 10%—40% (wt)Cu to pure copper or CuCr_(0.7) have been achieved by HIP processing. The tensile strength of specimen are approximate to or equal to that of copper (or CuCr_(0.7)). The bonding interface and fracture surface of tensile specimen have been investigated and some of mechanical and physical properties of Cu(or CuCr_(0.7)) have been analyzed. The problems concerning the quality of bonding have been discussed. The experimental results show that Cr is effective on diffusion and can improve the combined properties of bonded parts.