摘要
制备PIN二极管的几种方法 :扩散法、离子注入法、外延法和键合法。用各种方法制备PIN二极管的工艺过程。分析了各种方法的优缺点 ,着重比较了键合与外延方法制备PIN二极管。结果表明键合工艺制备PIN二极管不仅制造成本低 ,工艺简单 ,而且界面缺陷少 ,反向击穿电压高。所以用键合工艺制备PIN二极管可能成为未来主流制造技术。
The methodes are introduced on fabricating the PIN diodes:diffusion,ion implantation,epitaxy and bonding.The technology of fabricating the PIN diodes with various methodes is introduced. The advantages and disadvantages of these methods are analyzed.Emphasis are given on comparing epitaxy with bonding technology in producting the PIN diodes.The results show that bonding PIN diodes are not only low fabrication cost,simple technology,but also few defects and high breakdown voltages.So producting the PIN diodes with bonding technology is possible to become main fabrication technology.
出处
《电子器件》
CAS
2004年第2期372-376,共5页
Chinese Journal of Electron Devices
