摘要
目前半导体制造技术已经进入0.13μm时代,化学机械抛光(CMP)已经成为IC制造中不可缺少的技术。根据下一代IC对大尺寸硅片(≥300mm)面型精度和表面完整性的要求,分析了CMP(化学机械抛光)加工中大尺寸硅片夹持的关键之一—区域压力控制技术穴ZoneBackPressureControl雪,介绍了采用区域压力控制技术的必要性和理论基础,以及国内外研究现状和最新进展,并指出了该技术存在的问题与发展趋势。
Presently the semiconductor manufacturing technology has come into the age of 0.13um. Chemical mechanical polishing has become the indispensable technology in IC manufacture. Next generation IC needs large-scale wafers (300 mm) with high local and global planarization precision. This paper introduces research works of developed industry country on this key technology using for vacuum carrier-Zone Back Pressure which is used to mount wafers in CMP process, and then describes the development trend in the future.
出处
《电子工业专用设备》
2004年第7期34-39,共6页
Equipment for Electronic Products Manufacturing
