化学机械抛光流动性能分析

Analysis on Flow Properties of Chemical Mechanical Polishing Process

基于连续流体理论和其运动学关系 ,建立了力平衡方程关系式。推导了牛顿流体在化学机械抛光过程中的润滑方程 ,给出了模拟出的典型的压力分布情况和无量纲载荷、转矩与抛光垫转速变化的关系。计算结果表明 :抛光中的压力分布是沿半径方向变化的且抛光垫转速的增加将有助于提高抛光的切除速率。

The force balance relations were set up on the basis of continuum fluids theory and the kinematic relations. The flow governing equation, i.e. the Reynolds equation for chemical mechanical polishing (CMP) process was deduced with Newtonian fluids. The typical pressure distribution was simulated and the relations between the dimensionless load, dimensionless moments vs angular velocity of the pad were given. The pressure varies with the position in the radial direction and the increase in pad roll velocity is conducive to the remove rate of CMP process.