摘要
本文通过积层多层板在各个电子产品领域、品种中应用的体系图,介绍、分析了当前积层多层板的应用市场现状。
With diagram indicating the applications of build-up multilayer wiring board (BUM) in various realms and types of electronic products, the article introduces and analyzes the current condition of BUM in application market.
出处
《印制电路信息》
2004年第7期7-9,56,共4页
Printed Circuit Information
关键词
积层多层板
印制电路板
体系图
应用市场
build—up multilayer wiring board printed circuit board application market
