激光技术在刚挠性HDI板的应用——微导通孔形成，图形成形，外型加工

PCB Laser Technology for Rigid and Flex HDI:Via Formation, Structuring, and Routing

概述了采用一个激光源能够加工刚性和挠性板的一种新型激光技术,PCB制造商可能采用最小的投资和提高生产率而进入HDI市场.

A discussion of a new laser technology capable of working with both rigid and flexible boards using only one laser source. PCB manufacturers will be able to enter HDI market with a minimum investment and a guaranty of high yields for each technology step.