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在石墨基体上电沉积TiB_2镀层的研究 被引量:10

Study on Electrodeposition of TiB_2 Coating on Graphite Substrate
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摘要 采用K2TiF6-KBF4-KF-KCl融盐体系在石墨基体上电沉积制备TiB2镀层。考察了预电解条件和电活性组分的含量对镀层性能的影响。实验结果表明预电解对镀层的组成影响较大;在K2TiF6与KBF4的摩尔比为12.5,并且其总含量较高的条件下,镀层与基体结合力好,重复性好,但是晶粒较大,含有少量杂质;在K2TiF6与KBF4的摩尔比为17.5,并且其总含量较低的条件下,得到的镀层晶粒细小,有金属光泽,TiB2的纯度很高,但是重复性较差。需要进一步进行电化学实验,明确电沉积的机理。 In this paper TiB2 coating was electrodeposited on the graphite by K2TiF6-KBF4-KF-KCl molten salts. The effects of pre-electrolysis conditions and electroactive component contents on the properties of coating were tested. The results showed that: pre-electrolysis conditions had important effect on the compositions of coating; as the mole ratio of K2TiF6 and KBF4 is 1:2.5 with higher total content of K2TiF6-KBF4, the coating had better adhension to the substrate and the process had good repetition, but the crystal particle was large and the coating has less impurity; as the mole ratio of K2TiF6 and KBF(4)is 1:7.5 with lower total content of K2TiF6-KBF4, the coating had fine crystal particle and higher TiB2 content with metallic gloss, but the process had bad repetition. Further electrochemistry experiments need to be done to find the mechanism and stable conditions for electrodepositing of TiB2 coating.
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2004年第7期764-767,共4页 Rare Metal Materials and Engineering
基金 国家自然科学基金资助项目(50204006)
关键词 石墨 电沉积 TIB2 镀层 graphite electrodeposition TiB2 coating
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参考文献13

  • 1Billehaug K, Oye H A. Aluminum[J], 1980, 56:642
  • 2Matas ovsky K, Grjotheim K, Makyta M. Metall[J], 1988, 44:1196
  • 3QiuZhuxian(邱竹贤) WangZhaowen(王兆文) GaoBingliang(高炳亮)etal.稀有金属材料与工程,2001,30(1):503-506.
  • 4ZhaoQun(赵群) QiuZhuxian(邱竹贤).称有金属材料与工程,2002,31(1):528-531.
  • 5刘业翔.铝电解惰性阳极与可湿润性阴极的研究与开发进展[J].轻金属,2001(5):26-29. 被引量:75
  • 6Wieslaw A et al. JElectrochem Soc[J], 1986, (9): 1 777~1 781
  • 7Gesing A J, Jwheeler D. Light Metals[J], 1987, 327~334
  • 8Makyta M, Danek V. Journal of Applied Electrochemistry[J], 1996, 26:319~324
  • 9Gerhard Ett, Elisabete J. Pessine Electrochimica Acta[J], 1999,44:2 859~2 870
  • 10Ett G, Pessine E J. Plating and Surface Finishing[J], 2000,(6): 118~120

二级参考文献4

  • 1石青荣,Rare Met,1994年,13卷,161页
  • 2石青荣,北京科技大学学报,1994年,16卷,6期,599页
  • 3A. T. Tabereaux. Aluminum reduction technology—where to from here?[J] 2000,JOM(8):35~39
  • 4Barry J. Welch. Aluminum production paths in the new millennium[J] 1999,JOM(5):24~28

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