摘要
研究了厚膜镍导电浆料的制备及其烧结工艺,讨论了浆料中玻璃粉含量、烧结温度、保温时间及烧结气氛对烧结膜的附着力、方阻和可焊性的影响.结果表明:镍粉与玻璃粉的相对质量比100/8的厚膜镍导电浆料,在烧结温度750℃、保温时间10～15 min并有氮气保护的低氧分压烧结气氛时,可获得具有良好附着力、导电性和可焊性的膜层.
The preparation and sintering technology of thick-film nickel paste is researched and how the content of glass flour in the paste, the sintering temperature, the holding time and the firing atmosphere affect on the adhesion, the square conductivity and the weld performance of the thick film is also discussed. The result is indicated that the paste with 8wt% of glass flour based on the nickel powder sintered at 750℃ for 10~15 min under a low-oxygen-concentration atmosphere can be obtained a thick film with wonderful adhesion, high conductivity and good welding property.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第7期28-30,共3页
Electronic Components And Materials
关键词
镍粉
厚膜
导电浆料
nickel powder
thick film
conductive paste
