摘要
随着电子仪器向小型化、轻量化、高速化、多机能化方向的发展,实装电路板也由于各公司自行设计的各种式样而增多。在此,将介绍这些实装电路板的洗净时遇到的问题及其解决办法的事例。
Nowadays, Substrate/PCB design has become vary and complex under such situations; Electronic Device trend is small, lightweight, high-speed process and multi-function. This paper describes its cleaning difficulties and its solution based on the actual case.
出处
《电子工业专用设备》
2004年第9期13-17,22,共6页
Equipment for Electronic Products Manufacturing
关键词
准水基洗净
镍银
镀金
倒装片
直通式洗净法
Semi-Aquarius Cleaning
Ni-Ag Alloy
Au Plating
Flip Chip
DirectPass
