摘要
介绍混装印制板装联技术的工艺流程和各自特点,介绍了通孔再流焊技术的原理和工艺参数设计。通孔再流焊技术可以有效地适应表面组装技术的发展,科学地选用通孔再流焊技术是一种有效而可靠的焊接方法。
Introduce the flow chart of technology and their different characteristic in PCB mixed pin - through - hole and SMD,expound the principle and the design of technical parameters of pin-through-hole reflow soldering technology.Technically use PTH technology,PTH technology is a reliable soldering nethod.
出处
《电子工艺技术》
2004年第5期205-207,共3页
Electronics Process Technology
关键词
通孔再流焊
模板设计
焊膏量
Pin - through - hole reflow soldering
Stencil design
Solder paste volume
