摘要
介绍了一种芯片封装互连新工艺热超声倒装芯片连接工艺。在比较当前多种芯片封装方式的基础上,总结了这一工艺的特点及优越性,并详细论述了当前这一工艺的技术进展与理论研究状况,指出该工艺是芯片封装领域中具有发展潜力的新工艺。
A new chip bonding process that is called thermosonic flip-chip bonding is described.Based on comparing with the other similar chip bonding processes,summarize the characteristic and advantage of thermosonic flip chip bonding,and depict the current technology development and theoretical study situation of this process in detail.At last point out this process is a potential new process in the electronic packaging.
出处
《电子工艺技术》
2004年第5期185-188,共4页
Electronics Process Technology
基金
国家重大自然科学基金项目资助(项目编号为:50390064)
973项目资助(项目编号为:2003CB716202)。
关键词
热超声倒装芯片封装
技术进展
理论研究状况
新工艺
Thermosonic flip-chip bonding
Technology development
Theoretical study situation
New process
