摘要
我国印制电路板(PCB)的非ODS清洗技术已基本解决。当今需面对的是:(1)新型元器件的组装、(2)无铅焊工艺、(3)小产量生产的清洗技术,以及(4)优化方案的思考。
In general, Non-ODS PCB Cleaning technology has been resolved basically. And now weshould pay attention to get practical cleaning techniques for (1) assembly of new type devices (2) Lead-freeSoldering (3) Less Productivity and (4) design Optimization process.
