摘要
高速DSP的出现,使DSP工程师面临着日益严重的电磁干扰的威胁。文章针对DSP工程实践中的传输线理论、混合电路设计、电磁干扰和高速PCB板设计等方面,探讨如何实现电磁兼容。
With the emergence of DSP, the DSP engineers have been faced with the more and more serious problems that is EMI. One DSP engineer couldn't only consider excogitating the DSP products in time but also consider the EMC and EMI while designing, testing, installing and manufacturing them. Focus on the EMC and EMI matters in DSP engineering, how to up to EMC for the transmission line theories, the mixed circuits and high-rate PCB designing are discussed in this paper.
