摘要
提出了一种有机硅改性电子封装用双酚A型环氧树脂新方法———用二氯二甲基硅烷 (DMS)或其与α ,ω -二氯聚二甲基硅氧烷 (DPS)的混合物来改性双酚A型环氧树脂 ;测定了固化物的冲击强度、拉伸强度、断裂伸长率、玻璃化转变温度等 ;用扫描电子显微镜观察了改性材料的断面形态。结果表明 ,环氧树脂经 5 .7份DMS或 0 .7份DMS、10份DPS改性后 ,均达到了很好的增韧和提高耐热性等效果 ,符合电子封装材料改性要求 ;后者的增韧效果更为显著 。
Bisphenol A epoxy resin was modified by dimethyldichlorosilane (DMS),or a mixture of α,ω-chloro-polydimethylsiloxane (DPS) and DMS.The impact strength,tensile strength,elongation at break,and glass transition temperature of the modified systems were investigated.Systems containing 5 7 phr of DMS or 0.7 phr of DMS plus 10 phr of DPS were found possessing improved toughness and thermal resistance.The morphology of fracture surfaces of the latter system exhibited some rippled cluster,which was considered as a symbol of improved toughness.
出处
《中国塑料》
CAS
CSCD
北大核心
2004年第8期40-43,共4页
China Plastics
基金
广东省电子聚合物重点实验室基金资助项目 ( 2 0 0 3GD0 10 )
