玻璃纤维化学镀镍铜磷合金工艺的研究

Electroless Ni-Cu-P Alloy Plating Technology on Glass Fibet

通过清洗、粗化、活化等工艺对玻璃纤维进行前处理 ,然后利用化学镀技术在玻璃纤维表面沉积Ni Cu P合金。讨论了主盐、还原剂、配位体、温度、pH值等因素对化学镀反应沉积速度的影响 ,通过XPS对镀层的成分含量和电阻率测定分析 ,从而得到了主盐、还原剂对镀层成分含量以及导电性能的影响情况 ,得出了较优的工艺配方。所得玻璃纤维镀层中 ,镍的质量分数最大为 93.4 5 % ,铜的质量分数最大为 12 .99% ,导电玻璃纤维的电阻率可达4× 10 -4Ω·cm ,通过钯盐法得出镀液稳定性好 ,通过热震试验定性测得镀层的抗冲击强度高、结合力好。

Electroless Ni-Cu-P alloy plating was deposited on the surface of glass fiber,which was conducted with pretreatment processes as cleaning,coarsening,activating.Effects of main factors on the depositing rate were discussed including metallic salts,reducer,complex,temperature,and pH value.The composition content and resistivity of deposit were measured by using X-ray photoelectron spectroscopy (XPS) and digital multimeter.The effect of metallic salts and reducer on the composition content and conductivity of coatings were analyzed too.Finally optimized process and formula were obtained.The weight contents of Ni and Cu in the plating can reach 93.45% and 12.99% maximum,respectively.The volume resistivity of the conductive glass fiber is 4×10^(-4)Ω·cm.Pd-salt test shows that the bath is stable,and thermal shock experiment proves that the impact strength and adhesion of plating is better.