芯片封装中铜线焊接性能分析

Analysis of Copper Wire Bonding Performance in Chip Packaging

通过对纯铜的机械性能和电、热和化学氧化性能进行分析和比较,铜线在芯片引线键合具有良好的机械、电、热性能,它替代金线和铝线可缩小焊接间距,提高芯片频率和可靠性。但是,铜由于表面氧化使其可焊性较差,可采用焊接工艺来改善其可焊性,并给出了具体方案。

Through analysis of pure copper wire mechanical, electrical, thermal and oxidation property, the copper wire shows a good mechanical, electricial, and thermal properity in wire bonding of the chip. Instead of gold or aluminium wire, it can be used in wire bonding to shorten the spacing of bonding, and to enhance frequency and reliability of chip. But the copper wire has poor weldability because of the oxidation of its surface. So we must improve the weldability by reasonable bonding techniques and a practical scheme is given in this article.