摘要
The microstructures and properties of liquid film solution-diffusion welding interface for ZCuBe2.5 alloy have been studied using Cu-base powder. It reveals that the welding joint has high tensile strength up to 278 MPa, rational distribution of hardness and better matches with base materials in properties. Weld metal consists of the uniform and fine α-Cu equiaxed grain and intergranular Cu5.6Sn phase. The weld is well combined with base materials. The transition solid solution combination interface with a thickness of 150 μm has been formed. In the process of stable welding, the thickness of interface appears to have an increase linearly with bonding time. In the cases of same bonding time, the thickness of interface increases with an increase of temperature gradient, which will become even more apparent with the increase of bonding time.
The microstructures and properties of liquid film solution-diffusion welding interface for ZCuBe2.5 alloy have been studied using Cu-base powder. It reveals that the welding joint has high tensile strength up to 278 MPa, rational distribution of hardness and better matches with base materials in properties. Weld metal consists of the uniform and fine α-Cu equiaxed grain and intergranular Cu_(5.6)Sn phase. The weld is well combined with base materials. The transition solid solution combination interface with a thickness of 150 μm has been formed. In the process of stable welding, the thickness of interface appears to have an increase linearly with bonding time. In the cases of same bonding time, the thickness of interface increases with an increase of temperature gradient, which will become even more apparent with the increase of bonding time.
出处
《中国有色金属学会会刊：英文版》
CSCD
2004年第3期451-455,共5页
Transactions of Nonferrous Metals Society of China
关键词
ZCuBe2.5
铜合金
焊接
显微结构
性能
liquid film solution-diffusion welding
Cu-based alloy powder
ZCuBe2.5
microstructure
properties
