摘要
利用X射线衍射(XRD)织构分析技术研究了未退火及在400℃温度条件下经4h真空退火处理后的银薄膜织构。结果表明,银薄膜主要存在(111)和(100)面织构组份。银沉积薄膜(未退火)中(111)取向的晶粒多于(100)取向的晶粒。经退火处理后的硅基银薄膜表现更强的(111)和(100)面织构,而且(111)和(100)取向的晶粒数量基本相当。用表面能和应变能各向异性驱动晶粒生长的机理对此给予了解释。
Both the texture of as-deposited silver film and the same film annealed at 400℃ in vacuum atmosphere for 4 hours were investigated by XRD. The as-deposited silver film, as shown by quantitative analysis, has (111) and (100) texture component. After annealing at 400℃ for 4 hours, the (111) texture and (100) texture of the silver film attached to the silicon substrate strengthened greatly. The results were explained with the mechanism of grain growth driven by anisotropy of surface energy and strain energy.
出处
《理化检验（物理分册）》
CAS
2004年第8期395-397,403,共4页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
基金
国家自然科学基金资助项目(50271038)
关键词
银薄膜
退火
织构定量分析
Silver film
Annealing
Quantitative texture analysis
