含联苯结构环氧树脂体系固化反应动力学研究

Curing Reaction Kinetics of Epoxy Resin Containing Biphenyl Structure Using DDS as Curing Agent

用示差扫描量热仪 ( DSC)对含联苯结构环氧树脂 ( TMBP) /4,4′-二氨基二苯砜 ( DDS)固化体系的固化反应过程进行了分析 ,并用 Kissinger和 Ozawa方法分别求得体系固化反应的表观活化能 ΔE为 69.7和74.2 k J/mol,根据 Crane理论计算得到该体系的固化反应级数 n=0 .89及在不同升温速率下的频率因子 A,确定了使用

The reaction process of the curing system(TMBP/DDS) was studied by DSC and carefully analyzed. Based on the Kissinger method and Ozawa method, the apparent activation energy(ΔE) was got 69.7 and 74.2 kJ/mol respectively. The reaction order(n=0.89) and frequency factor A in various temperature were calculated according to Crane theory. The curing reaction condition was made by using DDS as the curing regent.