期刊文献+

High Temperature Characteristics of 3C-SiC/SiHeterojunctionDiodes Grown by LPCVD

3C-SiC/Si异质结二极管的高温特性(英文)
下载PDF
导出
摘要 The high temperature (300 ~480K) characteristics of the n-3C-SiC/p-Si heterojunction diodes (HJD) fabr icated by low-pressure chemical vapor deposition on Si (100) substrates are inv estigated.The obtained diode with best rectifying properties has 1.8×104 of ratio at room temperature,and slightly rectifying characteristics with 3.1 of rectification ratio is measured at 480K of an ambient temperature .220V of reverse breakdown voltage is acquired at 300K.Capacitance-voltage char acteristics show that the abrupt junction model is applicable to the SiC/Si HJD structure and the built-in voltage is 0.75V.An ingenious equation is employed to perfectly simulate and explain the forward current density-voltage data meas ured at various temperatures.The 3C-SiC/Si HJD represents a promising approach for the fabrication of high quality heterojunction devices such as SiC-emitter heterojunction bipolar transistors. 研究了低压化学气相淀积方法制备的 n- 3C- Si C/p- Si(10 0 )异质结二极管 (HJD)在 30 0~ 4 80 K高温下的电流密度 -电压 (J- V)特性 .室温下 HJD的正反向整流比 (通常定义为± 1V外加偏压下 )最高可达 1.8× 10 4 ,在 4 80 K时仍存在较小整流特性 ,整流比减小至 3.1.在 30 0 K温度下反向击穿电压最高可达 2 2 0 V .电容 -电压特性表明该 Si C/Si异质结为突变结 ,内建电势 Vbi为 0 .75 V.采用了一个含多个参数的方程式对不同温度下异质结二极管的正向 J-V实验曲线进行了很好的拟和与说明 ,并讨论了电流输运机制 .该异质结构可用于制备高质量异质结器件 ,如宽带隙发射极 Si C/Si
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2004年第9期1091-1096,共6页 半导体学报(英文版)
基金 国家重点基础研究专项基金 ( No.G2 0 0 0 0 683 ) 国家高技术研究与发展计划 ( No.2 0 0 1AA3 110 90 )资助项目~~
关键词 LPCVD heterojunction diodes high temperature characteristics LPCVD 异质结二极管 高温特性
  • 相关文献

参考文献4

二级参考文献47

  • 1Sheppard S T,Lauer V,Wondrak W,et al. High temperature performance of implanted-gate n-channel JFETs in 6H-SiC. Mat Sci Forum, 1998; 264 -268:1077.
  • 2Berg J von,Ziermann,Reichert W,et al. High temperature piezoresistive β-SiC-on-SOI pressure sensor for combustion engines. Mat Sci Forum, 1998; 264-268:1101.
  • 3Nishino S, Powell J A, Will H A. Production of largearea single-crystal waters of cubic SiC for semiconductor devices. Appl Phys Lett,1983;42(5):460.
  • 4Nishino S,Suhara H,Ono H,et al. Epitaxial growth and electric characteristics of cubic SiC on silicon. J Appl Phys,1987;61(10) :4889.
  • 5Yoshinobu T, Mitsui H, Tarui Y, et al. Heteroepitaxial growth of single crystalline 3C-SiC on Si substrates by gas source molecular beam epitaxy. J Appl Phys,1992;72(5):2006.
  • 6Sumakeris J J ,Rowland L B, Kern R S,et al. Layer-by-layer of SiC at low temperatures. Thin Solid Films,1993;225:219.
  • 7Boo J H,Lee S B,Ustin S A,et al. Growth of epitaxial cubic SiC thin films using single source precursors. Mat Sci Forum, 1998 ; 264- 268 : 187.
  • 8Takahashi T,Ishida Y,Okumura H,et al. Surface morphology of 3C-SiC heteroepitaxial layers grown by LPCVD on Si substrates. Mat Sci Forum, 1998;264-268 : 207.
  • 9Shim H W,Kim K C,Seo Y H,et al. Effects of void formation on electrical and optical properties of 3C-SiC on Si ( 111 ) substrates. Mat Sci Forum, 1998 ; 264 - 268:195.
  • 10Nagasawa H, Kawahara T, Yagi K. Heteroepitaxial growth and characteristics of 3C-SiC on large-diameter Si(001)substrates [J]. Mat. Sci. Forum., 2001, 389-393:319-322.

共引文献6

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部