固化工艺对HT1012铜粉导电胶剪切强度的影响

Effect of curing conditions of HT1012 copper powder electrically conductive adhesive on shear strength of single-lap joint

研究了固化工艺参数对由HT10 12型铜粉导电胶制备的单搭接接头剪切强度的影响。结果表明 ,在所采取的研究条件下 ,随着晾置时间的推移 ,导电胶剪切强度起初增加但随后减小 ;当固化温度为 6 0℃、晾置时间取定为 10min时 ,固化时间为 3h所对应的剪切强度较高 ;当变动固化温度时 ,固化温度提高会引起剪切强度下降。

s: The effect of curing condition of HT1012 conductive adhesive on the shear strength of single-lap joint was investigated. The results showed that the shear strength of the single-lap joint increased first and then decreased as the open assembly time lengthened. The shear strength was relatively higher when the open assembly time was 10 min and the curing time at 60 ℃ was 3 h. And the lower shear strength was obtained while the curing temperature was higher.